A solution to all conventional electronics cooling problems.💻
. Needless, to say that when that happens, it becomes dangerous both for the device and its surroundings.
He brought up the example of heat spreaders made of diamonds which are obviously very expensive. Second, he described how conventional heat spreading approaches generally place the heat spreader and a heat sin on top of the electronic device. Unfortunately,"in many cases, most of the heat is generated underneath the electronic device," meaning that the cooling mechanism isn't where it is needed most.
Third, explained Gebrael, heat spreaders can't be installed directly on the surface of the electronics. They require a layer of"thermal interface material" to be placed between them to ensure good contact. This material, however, has poor heat transfer characteristics resulting in a negative impact on thermal performance.Luckily, the researchers have come up with a new solution that addresses all three of those problems.
"In our study, we compared our coatings to standard heat sinking methods," Gebrael said."What we showed is that you can get very similar thermal performance, or even better performance, with the coatings compared to the heat sinks." The removal of the heat sink and thermal interface also guarantees that the device using the new solution is dramatically smaller than its conventional counterparts."And this translates to much higher power per unit volume. We were able to demonstrate a 740 percent increase in the power per unit volume," added Gebrael.
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